List of innovations

Ultra-thin, flexible chip package with fan-in/out re-distribution layer, embeddable in rigid or flexible PCBs

Chemistry
Electronics
Industrial Goods & Machinery
A patented, upscalable chip packaging method that allows off-the-shelf bare dies to be packaged in a flexible, ultra-thing package that can be embedded in a rigid or flexible PCB, thus enabling 2.5D miniaturization, copy protection, and enhanced mechanical flexibility and stability.

Benefits

  • 3d miniaturization at system level
  • Increased mechanical flexibility
  • Anti-copy and anti-tampering protection
  • Pcb embedding compatible with standard processes
  • Compatible with off-the-shelf bare die components

Issue

There are several needs in the market that current electronic assembly methods can no longer meet, pushing further towards PCB-embeddable chip solutions: - The constant demand for smart system designs for increased functionality per surface area requires novel, ultra-compact and/or 2.5D stacked packaging approaches - Surface-mounted, bulky components such as microcontrollers can severely hamper the mechanical flexibility of systems that need to be conformal, such as medical patches - Surface-mounted chips can be tampered with or copied - Soldered, surface-mounted chips are a reliability risk for electronic systems that need to perform under extreme temperatures or extreme mechanical conditions - Embedded die solutions are already available on the market, but these embed dies without a (fan-out) package, thus severely limiting the amount of I/Os and requiring fine pitch PCB technology. This approach also still suffers from the known-good-die problem and is only really feasible for high-volume applications due to the high set-up costs.

Solution

An ultra-thin, flexible chip package with fan-out/in that can be embedded both in rigid and flexible PCBs and with the following key features: - Thinnest available reliable chip package (60um) - Reduces footprint by embedding the chip in the printed circuit board - Embeddable in a printed circuit board using conventional industrial processes - Compatible with off-the-shelf bare dies - Able to embed ICs with high-density I/O contact pads - High yield thanks to known-good packaging approach - Flexible package, mechanical stability due to the solderless integration - Reliable at up to 300⁰C - Low set-up costs, accessible technology for low quantities

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